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? semiconductor components industries, llc, 2017 june, 2018 ? rev. 1 1 publication order number: nv25080lv/d nv25080lv, nv25160lv, nv25320lv, nv25640lv eeprom serial 8/16/32/64-kb spi low voltage automotive grade1 description nv25080lv, nv25160lv, nv25320lv, nv25640lv are a eeprom serial 8/16/32/64 ? kb spi low voltage automotive grade 1 devices internally organized as 1k/2k/4k/8kx8 bits. it features a 32 byte page write buffer and supports the serial peripheral interface (spi) protocol. the device is enabled through a chip select (cs ) input. in addition, the required bus signals are clock input (sck), data input (si) and data output (so) lines. the hold input may be used to pause any serial communication with the nv25xxx device. the device features software and hardware write protection, including partial as well as full array protection. byte level on ? chip ecc (error correction code) makes the device suitable for high reliability applications. the device offers an additional identification page which can be permanently write protected. features ? automotive temperatures: ? grade 1: ? 40 c to +125 c / v cc = 1.7 v to 5.5 v ? 20 / 10 mhz spi compatible ? spi modes (0,0) & (1,1) ? 32 ? byte page write buffer ? self ? timed write cycle ? hardware and software protection ? additional identification page with permanent write protection ? nv prefix for automotive and other applications requiring site and change control ? block write protection ? protect 1 / 4 , 1 / 2 or entire eeprom array ? low power cmos technology ? program/erase cycles: ? 4,000,000 at 25 c ? 1,200,000 at +85 c ? 600,000 at +125 c ? 200 year data retention ? soic, tssop, us 8 ? lead & wettable flank udfn 8 ? pad packages ? this device is pb ? free, halogen free/bfr free, and rohs compliant www. onsemi.com pin configuration si hold v cc v ss wp so cs 1 see detailed ordering and shipping information on page 11 of this data sheet. ordering information sck soic (dw), tssop (dt), udfn (muw3), us (uv) chip select cs serial data output so write protect wp ground v ss serial data input si serial clock sck function pin name pin function hold transmission input hold power supply v cc si so nv25xxxlv sck v ss v cc cs wp hold figure 1. functional symbol soic ? 8 dw suffix case 751bd tssop ? 8 dt suffix case 948al udfn8 muw3 suffix case 517dh us8 uv suffix case 493 1
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 2 table 1. absolute maximum ratings parameters ratings unit operating temperature ? 45 to +150 c storage temperature ? 65 to +150 c voltage on any pin with respect to ground (note 1) ? 0.5 to +6.5 v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. the dc input voltage on any pin should not be lower than ? 0.5 v or higher than v cc + 0.5 v. during transitions, the voltage on any pin may undershoot to no less than ? 1.5 v or overshoot to no more than v cc + 1.5 v, for periods of less than 20 ns. table 2. reliability characteristics (note 2) symbol parameter test condition max unit nend endurance t a 25 c, 1.7 v < v cc < 5.5 v 4,000,000 write cycles (note 3) t a = 85 c, 1.7 v < v cc < 5.5 v 1,200,000 t a = 125 c, 1.7 v < v cc < 5.5 v 600,000 tdr data retention t a = 25 c 200 year 2. determined through qualification/characterization. 3. a write cycle refers to writing a byte, a page, the status register or the identification page. table 3. dc operating characteristics (v cc = 1.7 v to 5.5 v, t a = ? 40 c to +125 c, unless otherwise specified.) symbol parameter test conditions min max unit i ccr supply current (read mode) read, so open v cc = 1.7 v, f sck = 5 mhz 1.5 ma v cc = 2.5 v, f sck = 10 mhz 2 ma v cc = 5.5 v, f sck = 20 mhz 3 ma i ccw supply current (write mode) write, cs = v cc 1.7 v < v cc < 5.5 v 2 ma i sb1 standby current v in = gnd or v cc , cs = v cc , wp = v cc , hold = v cc , v cc = 5.5 v 3 a 7 a i sb2 standby current v in = gnd or v cc , cs = v cc , wp = gnd, hold = gnd, v cc = 5.5 v 5 a 10 a i l input leakage current v in = gnd or v cc ? 2 2 a i lo output leakage current cs = v cc , v out = gnd or v cc ? 2 2 a v il1 input low voltage v cc 2.5 v ? 0.5 0.3 v cc v v ih1 input high voltage v cc 2.5 v 0.7 v cc v cc + 0.5 v v il2 input low voltage v cc < 2.5 v ? 0.5 0.2 v cc v v ih2 input high voltage v cc < 2.5 v 0.8 v cc v cc + 0.5 v v ol1 output low voltage v cc 2.5 v, i ol = 3.0 ma 0.4 v v oh1 output high voltage v cc 2.5 v, i oh = ? 1.6 ma v cc ? 0.8 v v v ol2 output low voltage v cc < 2.5 v, i ol = 150 a 0.2 v v oh2 output high voltage v cc < 2.5 v, i oh = ? 100 a v cc ? 0.2 v v v porth internal power ? on reset threshold 0.6 1.5 v product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions.
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 3 table 4. pin capacitance (t a = 25 c, f = 1.0 mhz, v cc = +5.0 v) (note 2) symbol test conditions min typ max unit c out output capacitance (so) v out = 0 v 8 pf c in input capacitance (cs , sck, si, wp , hold ) v in = 0 v 8 pf table 5. ac characteristics (note 4) symbol parameter v cc 2.5 v v cc = 2.5 v to 4.5 v v cc = 4.5 v to 5.5 v unit min max min max min max f sck clock frequency dc 5 dc 10 dc 20 mhz t su data setup time 20 10 5 ns t h data hold time 20 10 5 ns t wh sck high time 75 40 20 ns t wl sck low time 75 40 20 ns t lz hold to output low z 50 25 25 ns t ri (note 5) input rise time 2 2 2 s t fi (note 5) input fall time 2 2 2 s t hd hold setup time 0 0 0 ns t cd hold hold time 10 10 5 ns t v output valid from clock low 75 40 20 ns t ho output hold time 0 0 0 ns t dis output disable time 50 20 20 ns t hz hold to output high z 100 25 25 ns t cs cs high time 80 40 20 ns t css cs setup time 60 30 15 ns t csh cs hold time 60 30 15 ns t cns cs inactive setup time 60 30 15 t cnh cs inactive hold time 60 30 15 t wc (note 6) write cycle time 4 4 4 ms 4. ac test conditions: input pulse voltages: 0.3 v cc to 0.7 v cc at v cc > 2.5 v, 0.2 v cc to 0.8 v cc at v cc < 2.5 v input rise and fall times: 10 ns input and output reference voltages: 0.5 v cc output load: current source i ol max /i oh max ; c l = 30 pf 5. this parameter is tested initially and after a design or process change that affects the parameter. 6. t wc is the time from the rising edge of cs after a valid write sequence to the end of the internal write cycle. table 6. power ? up timing (notes 5, 7) symbol parameter max unit t pur power ? up to read operation 0.35 ms t puw power ? up to write operation 0.35 ms 7. t pur and t puw are the delays required from the time v cc is stable until the specified operation can be initiated.
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 4 pin description si: the serial data input pin accepts op ? codes, addresses and data. in spi modes (0,0) and (1,1) input data is latched on the rising edge of the sck clock input. so: the serial data output pin is used to transfer data out of the device. in spi modes (0,0) and (1,1) data is shifted out on the falling edge of the sck clock. sck: the serial clock input pin accepts the clock provided by the host and used for synchronizing communication between host and nv25xxx. cs : the chip select input pin is used to enable/disable the nv25xxx. when cs is high, the so output is tri ? stated (high impedance) and the device is in standby mode (unless an internal write operation is in progress). every communication session between host and nv25xxx must be preceded by a high to low transition and concluded with a low to high transition of the cs input. wp : the write protect input pin will allow all write operations to the device when held high. when wp pin is tied low and the wpen bit in the status register (refer to status register description, later in this data sheet) is set to ?1?, writing to the status register is disabled. hold : the hold input pin is used to pause transmission between host and nv25xxx, without having to retransmit the entire sequence at a later time. to pause, hold must be taken low and to resume it must be taken back high, with the sck input low during both transitions. when not used for pausing, the hold input should be tied to v cc , either directly or through a resistor. functional description the nv25xxx device supports the serial peripheral interface (spi) bus protocol, modes (0,0) and (1,1). the device contains an 8 ? bit instruction register. the instruction set and associated op ? codes are listed in table 7. reading data stored in the nv25xxx is accomplished by simply providing the read command and an address. writing to the nv25xxx, in addition to a write command, address and data, also requires enabling the device for writing by first setting certain bits in a status register, as will be explained later. after a high to low transition on the cs input pin, the nv25xxx will accept any one of the six instruction op ? codes listed in table 7 and will ignore all other possible 8 ? bit combinations. the communication protocol follows the timing from figure 2. the nv25xxx features an additional identification page (32 bytes) which can be accessed for read and write operations when the ipl bit from the status register is set to ?1?. the user can also choose to make the identification page permanent write protected. table 7. instruction set instruction op ? code operation wren 0000 0110 enable write operations wrdi 0000 0100 disable write operations rdsr 0000 0101 read status register wrsr 0000 0001 write status register read 0000 0011 read data from memory write 0000 0010 write data to memory figure 2. synchronous data timing cs sck si so t cnh t css t wh t wl t su t h hi ? z valid in valid out t csh t ri t fi t v t v t ho t cns t cs hi ? z t dis
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 5 status register the status register, as shown in table 8, contains a number of status and control bits. the rdy (ready) bit indicates whether the device is busy with a write operation. this bit is automatically set to 1 during an internal write cycle, and reset to 0 when the device is ready to accept commands. for the host, this bit is read only. the wel (write enable latch) bit is set/reset by the wren/wrdi commands. when set to 1, the device is in a write enable state and when set to 0, the device is in a w rite disable state. the bp0 and bp1 (block protect) bits determine which blocks are currently write protected. they are set by the user with the wrsr command and are non ? volatile. the user is allowed to protect a quarter, one half or the entire memory, by setting these bits according to table 9. the protected blocks then become read ? only. the wpen (write protect enable) bit acts as an enable for the wp pin. hardware write protection is enabled when the wp pin is low and the wpen bit is 1. this condition prevents writing to the status register and to the block protected sections of memory. while hardware write protection is active, only the non ? block protected memory can be written. hardware write protection is disabled when the wp pin is high or the wpen bit is 0. the wpen bit, wp pin and wel bit combine to either permit or inhibit write operations, as detailed in table 10. the ipl (identification page latch) bit determines whether the additional identification page (ipl = 1) or main memory array (ipl = 0) can be accessed both for read and write operations. the ipl bit is set by the user with the wrsr command and is volatile. the ipl bit is automatically reset after read/write operations. the lip (lock identification page) bit is set by the user with the wrsr command and is non ? volatile. when set to 1, the identification page is permanently write protected (locked in read ? only mode). note: the ipl and lip bits cannot be set to 1 using the same wrsr instruction. if the user attempts to set (?1?) both the ipl and lip bit in the same time, these bits cannot be written and therefore they will remain unchanged. table 8. status register 7 6 5 4 3 2 1 0 wpen ipl 0 lip bp1 bp0 wel rdy table 9. block protection bits status register bits array address protected protection bp1 bp0 0 0 none no protection 0 1 nv25080lv: 0300 ? 03ff, nv25160lv: 0600 ? 07ff, nv25320lv: 0c00 ? 0fff, nv25640lv: 1800 ? 1fff quarter array protection 1 0 nv25080lv: 0200 ? 03ff, nv25160lv: 0400 ? 07ff, nv25320lv: 0800 ? 0fff, nv25640lv: 1000 ? 1fff half array protection 1 1 nv25080lv: 0000 ? 03ff, nv25160lv: 0000 ? 07ff, nv25320lv: 0000 ? 0fff, nv25640lv: 0000 ? 1fff full array protection table 10. write protect conditions wpen wp wel protected blocks unprotected blocks status register 0 x 0 protected protected protected 0 x 1 protected writable writable 1 low 0 protected protected protected 1 low 1 protected writable protected x high 0 protected protected protected x high 1 protected writable writable
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 6 write operations the nv25xxx device powers up into a write disable state. the device contains a write enable latch (wel) which must be set before attempting to write to the memory array or to the status register. in addition, the address of the memory location(s) to be written must be outside the protected area, as defined by bp0 and bp1 bits from the status register. write enable and write disable the internal write enable latch and the corresponding status register wel bit are set by sending the wren instruction to the nv25xxx. care must be taken to take the cs input high after the wren instruction, as otherwise the write enable latch will not be properly set. wren timing is illustrated in figure 3. the wren instruction must be sent prior to any write or wrsr instruction. the internal write enable latch is reset by sending the wrdi instruction as shown in figure 4. disabling write operations by resetting the wel bit, will protect the device against inadvertent writes. figure 3. wren timing sck si so 00000 110 high impedance dashed line = mode (1, 1) cs figure 4. wrdi timing sck si so 00000 100 high impedance dashed line = mode (1, 1) cs
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 7 byte write once the wel bit is set, the user may execute a write sequence, by sending a write instruction, a 16 ? bit address and data as shown in figure 5. only 13 significant address bits are used by the nv25xxx. the rest are don?t care bits, as shown in table 11. internal programming will start after the low to high cs transition. during an internal write cycle, all commands, except for rdsr (read status register) will be ignored. the rdy bit will indicate if the internal write cycle is in progress (rdy high), or the device is ready to accept commands (rdy low). page write after sending the first data byte to the nv25xxx, the host may continue sending data, up to a total of 32 bytes, according to timing shown in figure 6. after each data byte, the lower order address bits are automatically incremented, while the higher order address bits (page address) remain unchanged. if during this process the end of page is exceeded, then loading will ?r oll over? to the first byte in the page, thus possibly overwriting previously loaded data. following completion of the write cycle, the nv25xxx is automatically returned to the write disable state. write identification page the additional 32 ? byte identification page (ip) can be written with user data using the same write commands sequence as used for page write to the main memory array (figure 6). the ipl bit from the status register must be set (ipl = 1) using the wrsr instruction, before attempting to write to the ip. the address bits [a15:a5] are don?t care and the [a4:a0] bits define the byte address within the identification page. in addition, the byte address must point to a location outside the protected area defined by the bp1, bp0 bits from the status register. when the full memory array is write protected (bp1, bp0 = 1,1), the write instruction to the ip is not accepted and not executed. also, the write to the ip is not accepted if the lip bit from the status register is set to 1 (the page is locked in read ? only mode). table 11. byte address address significant bits address don?t care bits # address clock pulses nv25640lv a12 ? a0 a15 ? a13 16 nv25320lv a11 ? a0 a15 ? a12 16 nv25160lv a10 ? a0 a15 ? a11 16 nv25080lv a9 ? a0 a15 ? a10 16 identification page a4 ? a0 a15 ? a5 16 figure 5. byte write timing sck si so 00 00 01 0 d7 d6 d5 d4 d3 d2 d1 d0 012345678 opcode data in high impedance byte address* 21 22 23 24 25 26 27 28 29 30 31 dashed line = mode (1, 1) cs a 0 a n 0 * please check the byte address table (table 11)
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 8 figure 6. page write timing sck si so 00 00 0 10 byte address* data byte 1 012345678 212223 24 ? 31 32 ? 39 data byte n opcode 7..1 0 24+(n ? 1)x8 ? 1 .. 24+(n ? 1)x8 24+nx8 ? 1 data in high impedance dashed line = mode (1, 1) cs a n a 0 data byte 3 data byte 2 0 * please check the byte address table (table 11) write status register the status register is written by sending a wrsr instruction according to timing shown in figure 7. only bits 2, 3, 4, 6 and 7 can be written using the wrsr command. write protection the write protect (wp ) pin can be used to protect the block protect bits bp0 and bp1 against being inadvertently altered. when wp is low and the wpen bit is set to ?1?, write operations to the status register are inhibited. wp going low while cs is still low will interrupt a write to the status register. if the internal write cycle has already been initiated, wp going low will have no effect on any write operation to the status register. the wp pin function is blocked when the wpen bit is set to ?0?. figure 7. wrsr timing 01 23 45678 10 911121314 sck si msb high impedance data in 15 so 7 6 5 4 3 2 10 0000000 1 opcode dashed line = mode (1, 1) cs
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 9 read operations read from memory array to read from memory, the host sends a read instruction followed by a 16 ? bit address (see table 11 for the number of significant address bits). after receiving the last address bit, the nv25xxx will respond by shifting out data on the so pin (as shown in figure 8). sequentially stored data can be read out by simply continuing to run the clock. the internal address pointer is automatically incremented to the next higher address as data is shifted out. after reaching the highest memory address, the address counter ?rolls over? to the lowest memory address, and the read cycle can be continued indefinitely. the read operation is terminated by taking cs high. read status register to read the status register, the host simply sends a rdsr command. after receiving the last bit of the command, the nv25xxx will shift out the contents of the status register on the so pin (figure 9). the status register may be read at any time, including during an internal write cycle. while the internal write cycle is in progress, the rdsr command will output the full content of the status register. for easy detection of the internal write cycle completion, we recommend sampling the rdy bit only through the polling routine. after detecting the rdy bit ?0?, the next rdsr instruction will always output the expected content of the status register. read identification page reading the additional 32 ? byte identification page (ip) is achieved using the same read command sequence as used for read from main memory array (figure 8). the ipl bit from the status register must be set (ipl = 1) before attempting to read from the ip. the [a4:a0] are the address significant bits that point to the data byte shifted out on the so pin. if the cs continues to be held low, the internal address register defined by [a4:a0] bits is automatically incremented and the next data byte from the ip is shifted out. the byte address must not exceed the 32 ? byte page boundary. figure 8. read timing sck si so byte address* 0123456789 7 6 5 4 3 2 1 0 data out msb high impedance opcode 21 20 22 23 24 25 26 27 28 29 30 00 00 0 11 dashed line = mode (1, 1) a 0 a n cs * please check the byte address table (table 11) 0 10 figure 9. rdsr timing 01 2345678 10 911121314 sck si data out msb high impedance opcode so 7 6 5 4 3 2 1 0 00000 1 01 dashed line = mode (1, 1) cs
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 10 hold operation the hold input can be used to pause communication between host and nv25xxx. to pause, hold must be taken low while sck is low (figure 10). during the hold condition the device must remain selected (cs low). during the pause, the data output pin (so) is tri ? stated (high impedance) and si transitions are ignored. to resume communication, hold must be taken high while sck is low. design considerations the nv25xxx device incorporates power ? on reset (por) circuitry which protects the internal logic against powering up in the wrong state. the device will power up into standby mode after v cc exceeds the por trigger level and will power down into reset mode when v cc drops below the por trigger level. this bi ? directional por behavior protects the device against ?brown ? out? failure following a temporary loss of power. the nv25xxx device powers up in a write disable state and in a low power standby mode. a wren instruction must be issued prior to any writes to the device. after power up, the cs pin must be brought low to enter a ready state and receive an instruction. after a successful byte/page write or status register write, the device goes into a write disable mode. the cs input must be set high after the proper number of clock cycles to start the internal write cycle. access to the memory array during an internal write cycle is ignored and programming is continued. any invalid op ? code will be ignored and the serial output pin (so) will remain in the high impedance state. figure 10. hold timing sck so high impedance dashed line = mode (1, 1) t lz cs hold t cd t hd t hd t cd t hz error correction code the nv25xxx incorporates on ? board error correction code (ecc) circuitry, which makes it possible to detect and correct one faulty bit in a byte. ecc improves data reliability by correcting random single bit failures that might occur over the life of the device.
nv25080lv, nv25160lv, nv25320lv, nv25640lv www. onsemi.com 11 table 12. ordering information (notes 8, 9) opn density automotive grade package type shipping ? nv25080dtvlt3g* 8 kb grade 1 ( ? 40 c to +125 c) tssop ? 8 (pb ? free) 3000 / tape & reel nv25080dwvlt3g* 8 kb grade 1 ( ? 40 c to +125 c) soic ? 8 (pb ? free) 3000 / tape & reel nv25080muw3vlt3g* 8 kb grade 1 ( ? 40 c to +125 c) udfn ? 8 (pb ? free) wettable flank 3000 / tape & reel nv25080uvlt2g* 8 kb grade 1 ( ? 40 c to +125 c) us8 (pb ? free) 3000 / tape & reel NV25160DTVLT3G* 16 kb grade 1 ( ? 40 c to +125 c) tssop ? 8 (pb ? free) 3000 / tape & reel nv25160dwvlt3g* 16 kb grade 1 ( ? 40 c to +125 c) soic ? 8 (pb ? free) 3000 / tape & reel nv25160muw3vlt3g* 16 kb grade 1 ( ? 40 c to +125 c) udfn ? 8 (pb ? free) wettable flank 3000 / tape & reel nv25160uvlt2g* 16 kb grade 1 ( ? 40 c to +125 c) us8 (pb ? free) 3000 / tape & reel nv25320dtvlt3g* 32 kb grade 1 ( ? 40 c to +125 c) tssop ? 8 (pb ? free) 3,000 / tape & reel nv25320dwvlt3g* 32 kb grade 1 ( ? 40 c to +125 c) soic ? 8 (pb ? free) 3,000 / tape & reel nv25320muw3vlt3g* 32 kb grade 1 ( ? 40 c to +125 c) udfn ? 8 (pb ? free) wettable flank 3,000 / tape & reel nv25320uvlt2g* 32 kb grade 1 ( ? 40 c to +125 c) us8 (pb ? free) 3,000 / tape & reel nv25640dtvlt3g 64 kb grade 1 ( ? 40 c to +125 c) tssop ? 8 (pb ? free) 3,000 / tape & reel nv25640dwvlt3g 64 kb grade 1 ( ? 40 c to +125 c) soic ? 8 (pb ? free) 3,000 / tape & reel nv25640muw3vlt3g* 64 kb grade 1 ( ? 40 c to +125 c) udfn ? 8 (pb ? free) wettable flank 3,000 / tape & reel nv25640uvlt2g* 64 kb grade 1 ( ? 40 c to +125 c) us8 (pb ? free) 3,000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *product in developement. 8. all packages are rohs ? compliant (pb ? free, halogen ? free). 9. the standard lead finish is nipdau.
udfn8 2x3, 0.5p case 517dh issue o date 06 nov 201 5 scale 2:1 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. 5. for device opn containing w option, detail b alternate construction is not applicable. ?? ?? ?? a d e b c 0.05 pin one indicator top view side view bottom view l d2 e2 c c 0.10 c 0.08 a1 seating plane note 3 b 8x 0.10 c 0.05 c a b dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.20 0.30 d 2.00 bsc d2 1.30 1.50 e 3.00 bsc e2 1.30 1.50 e 0.50 bsc l 0.30 0.50 1 4 8 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.50 pitch 1.55 3.40 1 dimensions: millimeters 1 note 4 0.30 8x detail a a3 0.13 ref a3 a detail b l1 detail a l alternate constructions l l1 ??? 0.15 e recommended 5 1.56 generic marking diagram* xxxxx = specific device code a = assembly location wl = wafer lot y = year w = work week = pb?free package *this information is generic. please refer to device data sheet for actual part marking. pb?free indicator , ?g? or microdot ? ?, may or may not be present. xxxxx awlyw 1 m m 0.68 c 0.05 8x ?? detail b mold cmpd exposed cu alternate constructions ??? mechanical case outline package dimensions http://onsemi.com 1 ? semiconductor components industries, llc, 2002 october, 2002 ? rev. 0 case outline number: xxx document number: status: reference: description: 98aon06579g on semiconductor standard udfn8 2x3, 0.5p electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped ?controlled copy? in red. page 1 of 2
document number: 98aon06579g page 2 of 2 issue revision date o released for production. req. by i. hyland. 06 nov 2015 ? semiconductor components industries, llc, 2015 november, 2015 ? rev. o case outline number : 517dh on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
soic 8, 150 mils case 751bd ? 01 issue o date 19 dec 2008 e1 e a a1 h l c e b d pin # 1 identification top view side view end view notes: (1) all dimensions are in millimeters. angles in degrees. (2) complies with jedec ms-012. symbol min nom max a a1 b c d e e1 e h 0o 8o 0.10 0.33 0.19 0.25 4.80 5.80 3.80 1.27 bsc 1.75 0.25 0.51 0.25 0.50 5.00 6.20 4.00 l 0.40 1.27 1.35 mechanical case outline package dimensions http://onsemi.com 1 ? semiconductor components industries, llc, 2002 october, 2002 ? rev. 0 case outline number: xxx document number: status: reference: description: 98aon34272e on semiconductor standard soic 8, 150 mils electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped ?controlled copy? in red. page 1 of 2
document number: 98aon34272e page 2 of 2 issue revision date o released for production from pod #soic8 ? 002 ? 01 to on semiconductor. req. by b. bergman. 19 dec 2008 ? semiconductor components industries, llc, 2008 december, 2008 ? rev. 01o case outline number: 751bd on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
tssop8, 4.4x3 case 948al ? 01 issue o date 19 dec 2008 e1 e a2 a1 e b d c a top view side view end view 1 l1 l notes: (1) all dimensions are in millimeters. angles in degrees. (2) complies with jedec mo-153. symbol min nom max a a1 a2 b c d e e1 e l1 0o 8o l 0.05 0.80 0.19 0.09 0.50 2.90 6.30 4.30 0.65 bsc 1.00 ref 1.20 0.15 1.05 0.30 0.20 0.75 3.10 6.50 4.50 0.90 0.60 3.00 6.40 4.40 mechanical case outline package dimensions http://onsemi.com 1 ? semiconductor components industries, llc, 2002 october, 2002 ? rev. 0 case outline number: xxx document number: status: reference: description: 98aon34428e on semiconductor standard tssop8, 4.4x3 electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped ?controlled copy? in red. page 1 of 2
document number: 98aon34428e page 2 of 2 issue revision date o released for production from pod #tssop8 ? 004 ? 01 to on semiconductor. req. by b. bergman. 19 dec 2008 ? semiconductor components industries, llc, 2008 december, 2008 ? rev. 01o case outline number: 948al on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
mechanical case outline package dimensions us8 case 493 issue d date 15 jul 2015 scale 4 :1 dim a min max min max inches 1.90 2.10 0.075 0.083 millimeters b 2.20 2.40 0.087 0.094 c 0.60 0.90 0.024 0.035 d 0.17 0.25 0.007 0.010 f 0.20 0.35 0.008 0.014 g 0.50 bsc 0.020 bsc h 0.40 ref 0.016 ref j 0.10 0.18 0.004 0.007 k 0.00 0.10 0.000 0.004 l 3.00 3.20 0.118 0.128 m 0 6 0 6 n 0 10 0 10 p 0.23 0.34 0.010 0.013 r 0.23 0.33 0.009 0.013 s 0.37 0.47 0.015 0.019 u 0.60 0.80 0.024 0.031 v 0.12 bsc 0.005 bsc notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. dimension a does not include mold flash, protrusion or gate burr. mold flash. protrusion and gate burr shall not exceed 0.14mm (0.0055?) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash and protrusion shall not exceed 0.14mm (0.0055?) per side. 5. lead finish is solder plating with thickness of 0.0076?0.0203mm (0.003?0.008?). 6. all tolerance unless otherwise specified 0.0508mm (0.0002?). l b a p g 4 1 5 8 c k d seating j s r u detail e v f h n r 0.10 typ m detail e t m 0.10 (0.004) xy t 0.10 (0.004) plane xx = specific device code m = date code = pb?free package 1 8 xx m generic marking diagram* *this information is generic. please refer to device data sheet for actual part marking. (note: microdot may be in either location) x y t 0.30 8x dimensions: millimeters *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting t echniques reference manual, solderrm/d. soldering footprint* 0.50 recommended 1 pitch 3.40 0.68 8x http://onsemi.com 1 ? semiconductor components industries, llc, 2002 october, 2002 ? rev. 0 case outline number: xxx document number: status: new standard: description: 98aon04475d on semiconductor standard us8 electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped ?controlled copy? in red. page 1 of 2
document number: 98aon04475d page 2 of 2 issue revision date o released for production. req by r. forness 19 mar 2001 a changed dim ?p? to 0.23 mm min, 0.34 mm max and 0.010 in min, 0.013 in max. req by j. miller 25 jun 2003 b added soldering footprint. req. by d. truhitte. 13 apr 2006 c modified soldering footprint. req. by b. becker. 23 mar 2015 d modified dimension a min value and dimension c max value for mm. req. by r. avila. 15 jul 2015 ? semiconductor components industries, llc, 2015 july, 2015 ? rev. d case outline number : 49 3 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different a pplications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical e xperts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc prod uct could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was neglig ent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does on semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?

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